Title: Underfill Selection to Improve Solder Joint Reliability For Down Hole Drilling Applications Author: Sriram Jayanthi Date/Time: November 19, 2020 10:00am-12:00pm Examining Committee: Professor Patrick McCluskey, Chair Professor Abhijit Dasgupta Dr. Michael Azarian Abstract: Underfill materials were originally developed to improve the solder joint reliability of the BGA packages under the thermal cycling when they are experiencing stresses … Continue reading Thesis Defense: Sriram Jayanthi