Title: Thermoelectric Cooling of High-Flux Electronics
Date: Thursday, August 10th, 2017
Location: Aerospace Engineering Conference Room, 3164 Glenn Martin Hall
List of Committee Members:
Prof. Bao Yang (Chair)
Prof. Avram Bar-Cohen
Prof. Patrick McCluskey
Prof. Yunho Hwang
Abstract: On-Chip Thermoelectric cooling is a promising solution for thermal management of next generation integrated circuits. This thesis focuses on various thermoelectric cooling applications; cooling of high flux hotspots, thermal de-coupling of chips with different operating temperatures, and cooling of quantum cascade lasers. A micro contact enhanced thin film thermoelectric cooler was designed for remediation of a 5kW/cm2 hotspot and its integration with manifold microchannel system is numerically demonstrated. In addition, thermoelectric cooling was utilized for thermal de-coupling of electronic chips with different operating temperatures, eliminating the need to over-cool the entire package.
Furthermore, effect of decreasing contact resistances in thin film thermoelectrics was numerically investigated to effectively remove 100W (~280W/cm2) of heat dissipation from quantum cascade lasers.
Finally, a system-level optimization methodology is established with comprehensive mathematical modeling, verified with numerical simulations. Master curves are generated to understand the effect of system-level parasitics on performance and optimal design variables.