Intel is hiring and we have an open full-time R&D Engineer position in the Experimental Mechanics Lab at the Chandler (Phoenix, Arizona) campus. We are seeking candidates with an MS/PhD degree and a strong background in Experimental Mechanics & interest in hands-on work in a lab environment. Interested candidates can email their resume to the hiring manager – Pramod Malatkar (firstname.lastname@example.org).
Assembly and Test Technology Development (ATTD) Experimental Mechanics Lab deals with thermo-mechanical challenges in the development of advanced packaging technologies. The personnel in this R&D lab use a variety of tools to study the behavior of electronic packages and their material constituents under different mechanical and/or thermal loading conditions: like dynamic warpage of packages using optics-based tools; interfacial adhesion strength using Double Cantilever Beam test; fracture toughness of bulk materials using three-point bend test; material CTE using Digital Image Correlation method; and defect (or crack) detection & classification using optical (or acoustic emission) sensors and AI/ML codes. Employees also develop new metrologies and software capabilities for use with next-gen packaging technologies. An ideal candidate for this position is one with a strong background in Experimental Mechanics, along with problem solving and programming skills.
You must possess the below minimum qualifications to be initially considered for this position.
• Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
• Relevant experience can be obtained through school work, classes and project work, internships, military training, and/or work experience.
• Possess a master’s degree and 6+ months of experience or PhD degree and 1+ years of experience in one of the following majors: Mechanical Engineering, Aerospace Engineering, Materials Science and Engineering, or related field.
• Must have the required degree or expect the required degree by July 2022.
6+ months of experience (master’s degree) or 1+ years of experience (PhD degree) with one or more of the following:
• Material characterization, load frames, DAQs, PID controllers, basic optics, 3D CAD, silicon photonics, Cu-Cu hybrid bonding, and/or structural health monitoring.
• LabView, Matlab, and/or Python programming.