R&D ENGINEER POSITION – INTEL Corp.
Job Description: Assembly and Test Technology Development (ATTD) Experimental Mechanics Lab deals with thermo-mechanical challenges in the development of advanced packaging technologies. The personnel in this R&D lab use a variety of tools to study the behavior of electronic packages and their material constituents under different mechanical and/or thermal loading conditions: like dynamic warpage of packages […]
R&D ENGINEER POSITION – INTEL Corp. Read More »