The successful candidate will take an exciting and leading technical role in a DOE/ARPA-E project in the REPAIR program that is being led by UMD. The position involves thermal and structural modeling of a natural gas distribution pipe environment during a high-temperature (>1000 degC) sintering process that is used to deposit a new layer of metal within an existing pipe. The goal is to quantify the temperature profile within the pipe and its surroundings for a range of process conditions, and to quantify the structural properties of the “pipe in pipe” structure that results from the deposition process. The modeling results will directly inform process design and innovation, and the successful candidate will be deeply involved in improving the metal deposition process for this natural gas pipe application.
The position will be in the Albertus research group in the Department of Chemical and Biomolecular Engineering, but also work closely with the Hu research group in the Department of Materials Science and the three project industrial parners (HighT-Tech LLC, a UMD spin out, Diakont, and Exelon). This will be a fast-paced, results-oriented, high-profile, and team-based project.
More information on the REPAIR program is available here:
More information on the UMD project is available here:
- A PhD or equivalent experience in engineering or the physical sciences.
- Significant experience with 3D, transient, finite-element modeling of thermal, structural mechanics, and/or related processes.
- A strong publication record demonstrating originality, technical depth, and the ability to conduct research both independently and as part of a team.
- Strong physical intuition and an ability to identify and quantify the leading order effects in a 3D, multi-physics, coupled, physical system.
- Effective written and oral communications skills.
- Modeling of conjugate heat transfer.
- Experience with a modeling package such as Comsol or Ansys.
- Demonstrated experience with IP creation and filing patents. The project will include significant opportunities for creating and filing IP.
Best Consideration Date: 11/01/2020