Thesis Defense – Hyun Seop Lee
Title: Temperature Dependent Characterization of Polymers for Accurate Prediction of Stresses in Electronic Packages Author: Hyun Seop Lee Date/Time : May 18, 1~3 pm Committee members:Prof. Bongtae Han (Chair)Prof. Abhijit DasguptaProf. Patrick McCluskeyProf. Peter SandbornProf. Sung W. Lee (Dean’s representative) Abstract: Epoxy molding compound (EMC) is a thermosetting polymer filled with inorganic fillers such as […]
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