Announcements

Tandon Faculty First Look Fellowship

The NYU Tandon School of Engineering invites scholars currently underrepresented in engineering fields who are nearing completion of their doctorates or who are in post-doctoral positions to apply for Tandon Faculty First Look Fellowships. Fellows will have the opportunity to present and receive feedback on their ongoing research, engage with NYU faculty from a range of engineering […]

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Ph.D. Student Harnoor Singh Sachar Selected as Finalist For Frank J. Padden, Jr. Award

Mechanical Engineering Ph.D. student, Harnoor Singh Sachar, has been selected as a finalist for the Frank J. Padden, Jr. Award sponsored by the College of Polymer Science and Engineering, University of Akron. As a finalist, Sachar will present his research in the 2021 Padden Award Symposium organized by the Division of Polymer Physics of the

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Dropping a Graduate Course or Withdrawing from all Courses

On November 16, the Provost emailed all students announcing that the deadline to withdraw from a course has been extended to November 30 to provide students who have been profoundly impacted by the pandemic conditions with more flexibility.  In considering your options, it is important that graduate students and program advisors understand the potential implications of withdrawing

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NREL Internship Opportunity and Solar Decathlon Mentor Program

We are reaching out to share an exciting internship opportunity as a Student Design Competition Intern at the National Renewable Energy Laboratory (NREL) in Golden, Colorado. This will be a full-time, one-year, paid position, and the successful candidate will support various NREL efforts and projects, including support to student competitions in building science; domestic technical

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Thesis Defense: Sriram Jayanthi

Title: Underfill Selection to Improve Solder Joint Reliability For Down Hole Drilling Applications Author: Sriram Jayanthi Date/Time: November 19, 2020 10:00am-12:00pm Examining Committee: Professor Patrick McCluskey, Chair Professor Abhijit Dasgupta Dr. Michael Azarian Abstract: Underfill materials were originally developed to improve the solder joint reliability of the BGA packages under the thermal cycling when they are experiencing stresses

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Tale of Two Pandemics: Illuminating Structural Racism and COVID

Powered by Research Commons at University Libraries. Starting in 2015, the Interdisciplinary Dialogues have addressed such important issues as income inequality, immigration, social media and elections, and sex and gender in academia. Please note that all Fall 2020 events will be held virtually via Zoom. Registrants will receive an event link in their confirmation email. As

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Internship Opportunity – Seagate Technology

There is an exciting internship opportunity for the Spring of 2021 at Seagate Technology, a hard drive manufacturing company. In this internship, the intern will get a chance to work on real-world machinery data, and industry 4.0 related projects. Here are the preferred qualifications:  Current master or PhD students in mechanical engineering. Solid programming experience in Python, Keras,

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Virtual Technical Meeting: Exploring Data Requirements for Risk and Reliability Analysis in Hydrogen Systems

Presenters: Camila Correa Jullian & Katrina Groth Host: University of Maryland Date/Time: November 17, 2020. 11:00AM EDT Risk and reliability analysis are critical to the development of safesystems, designing maintenance strategies, and creating codes andstandards. We are exploring the suitability of modern tools for riskassessment, such as QRA (Quantitative Risk Assessment), and reliabilityanalysis, such as

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Dissertation Defense – Guanjin Wang

Title: Physics-Based and Data-Driven Modeling of Hybrid Robot Movement on Soft Terrain Author: Guanjin Wang Advisory Committee: Professor Balakumar Balachandran, Chair & Advisor Associate Professor Amir Riaz (Co-Advisor) Professor Teng Li Professor Amr Baz Professor Peter Chung Professor Derek Richardson (Dean’s Representative) Date & Time: November 13, 2020 2pm-4pm Abstract: Navigating the unmapped environment is one

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