Dissertation Defense – Qian Jiang
Anisotropic Multi-scale Modeling for Steady-state Creep Behavior of Polycrystalline Coarse-grain SnAgCu (SAC) Solder Joints Author: Qian Jiang Day/Time: June 10, 12:00 noon – 2:00 pm List of committee membersProfessor Abhijit Dasgupta, ChairProfessor Hugh Alan BruckProfessor Teng LiProfessor Patrick McCluskeyProfessor Lourdes G. Salamanca-Riba, Dean Representative Abstract:Heterogeneous integration is leading to unprecedented miniaturization of solder joints. The overall size of solder […]
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